PRESS INVITATION TO FIBOCOM/ FIA PRODUCT RELEASE

We are pleased to invite MWC journalists to join FIBOCOM/ FIA product announcement that will take part at Mobile World Congress.

Date/Time: 25th of February from 01:00 to 02:30pm.
Venue FIBOCOM: Hall 1. Stand 1E21.

The journalist also will be able to interview FIBOCOM representatives:
President of FIA USA Tom Burton
CEO Mr.Ying TBD
CTO Mr.Xu TBD

FIA is built as a collaboration with operators and partners to focus on new innovations and IoT devices born from the advances of 5G connectivity. With a strong background in IoT through support from Fibocom Wireless Inc., Fibocom is the first wireless communication module and solution provider listed publicly in China(SHE: 300638). For over 20 years, Fibocom has been dedicated to providing many global top 500 IoT consumer electronics, and global carrier companies with end-to-end wireless communication solutions covering 5G, LTE, NB-IoT/eMTC, HSPA+, and GSM/ GPRS. This strong background is further enabled by the world’s largest PC parts/CPU manufacturer, and major Fibocom shareholder, Intel.

For more information: www.fibocom.com.

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