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Shenzhen, China; Barcelona, Spain – February 25, 2019 FIBOCOM Wireless (SHE: 300638) unveils its Intel powered 5G module for the global vertical markets at the Mobile World Congress in Barcelona, Spain. FG100, the first of Fibocom’s 5G family modules, featuring Intel® XMM™ 8160 5G modem, offers a “One World One SKU” solution to enable 5G globally with a standardized M.2 form factor.

We are pleased to invite MWC journalists to join FIBOCOM/ FIA product announcement that will take part at Mobile World Congress.

Date/Time: 25th of February from 01:00 to 02:30pm.
Venue FIBOCOM: Hall 1. Stand 1E21.

The journalist also will be able to interview FIBOCOM representatives:
President of FIA USA Tom Burton
CEO Mr.Ying TBD
CTO Mr.Xu TBD

FIA develops supply chain platform that based on smart hard device since establishment suppliers FIA announces to showcase the innovation with the support of Fibocom which is the leading global provider of wireless modules for the Internet of Things (IoT). It collaborates with operators for new business through discovering IoT devices and innovations.

The 2019 edition of MWC is being organised in Barcelona, Spain from 25 –28 February 2019. Visitors can meet the FIA team at their stand located in - Hall 1. Stand 1E21.

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